Advanced manufacturing for lithographic processes depends on innovative chemical solutions. The solutions maximize yield and minimize costs and waste in such manufacturing processes as optical media, holograms, leading-edge microlithography and e-beam manufacturing.
Relevant Formulas
Specialized chemistry makes the differenc in micro and nano fabrication:
Negative Tone Resist for EBL
A dry-silica-resin-derived hydrogen silsesquioxane resist in an MIBK carrier solvent yields superior pitch resolution, etch resistance and sensitivity in thin-film, direct-write electron beam lithographic processes.
Resist Adhesion for Microlighography
Multiple substrates in electron beam and photon lithography get better coating and adhesion with specially-formulated waterborne agents.
Anti-Charging Agents for E-Beam Lithographic Processes
Substrates with electric insulation prevent charge accumulation in EBL lithography systems with anti-charging agents.
Cleaners for Optical Substrates
Oxidation products, water stains, electrostatic contaminants and organic residues can be effectively removed with an active cationic surface agent.
Electroforming
Specialized concentrates based on electronic-grade sulfamate nickel for low-stress electroforming are formulated for electronics-manufacturing applications.
Analytical Services
Lithography systems also benefit from complete analysis for trouble shooting and optimization of electroforming solutions based on nickel sulfamate. These include:
• Concentration of Nickel Metal and Boric Acid
• pH
• Deposit Internal Stress
• Surface Tension
• Copper, Iron, Chrome, Zinc and Lead Contamination
• Analysis Reports and Recommendations
Innovative Chemical Solutions
Ongoing innovations in chemical solutions to enhance such lithographic manufacturing applications as optical media, holograms, state-of-the-art developments in e-beam and microlithography manufacturing get better results with higher efficiency. Contact DisChem Inc at or visit today.